Effect of raw material and adhesive on thermal degradation of particle boards

Abstract

The objective of this study was to analyze the thermal degradation of non-conventional particleboards made from different raw materials and adhesives through thermogravimetric analysis. Panels made from sugarcane bagasse with urea-formaldehyde and three tropical woods with phenol-formaldehyde were tested. Dry samples were heated from room temperature up to 1000 °C, recording mass loss every 2 minutes. Degradation occurred in three stages: drying (50 °C-200 °C), active pyrolysis (200 °C-400 °C), and charcoal formation/burning (400 °C-1000 °C). The type of biomass and resin influenced degradation, except at the temperature of the highest mass loss rate. Sugarcane bagasse panels showed lower thermal stability, while tropical wood panels were more stable.