Influence of Diode Laser on Evaporation of Solvents in Adhesive Systems
DOI:
https://doi.org/10.22456/2177-0018.145796Keywords:
Lasers, Evaporation, Dentin-Bonding Agents, SolventsAbstract
Purpose: Evaluate the influence of diode laser at different power outputs and times on evaporation of the adhesive system solvent.
Materials and methods: Two conventional adhesive systems (Adper Scotchbond Multi Purpose, 3M ESPE and Adper Single Bond 2, 3M ESPE) and two self-etching adhesive systems (Clearfil SE Bond, Kurarai and Optibond All-in-one, Kerr) were tested. Ten microliters of each adhesive system were dispensed in a concave glass container and the mass loss was measured using a digital analytical balance. Solvent evaporation techniques included an air drying stream at 10 cm for 5 seconds (control technique) and diode laser irradiated continuously at 1 cm distance with power outputs 1, 2 and 3 W for 5, 10, 15, 20 and 25 seconds (experimental techniques). Six repetitions (n=6) were performed for each adhesive and technique. The data were subjected to analysis of variance and Tukey tests (α= 5%).
Results: Based on the values of the solvent evaporation rates verified in this study, the diode laser caused solvent evaporation of adhesive systems.
Discussion: The diode laser influenced solvent evaporation, with higher power and/or longer exposure increasing evaporation rate. It may be an alternative to the conventional method but requires further clinical studies.
Conclusions: The laser achieved better results for the conventional adhesive systems when compared with the self-etching systems, since the results were influenced by the irradiation parameters.
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